JPH064605Y2 - 混成集積回路 - Google Patents
混成集積回路Info
- Publication number
- JPH064605Y2 JPH064605Y2 JP1988107163U JP10716388U JPH064605Y2 JP H064605 Y2 JPH064605 Y2 JP H064605Y2 JP 1988107163 U JP1988107163 U JP 1988107163U JP 10716388 U JP10716388 U JP 10716388U JP H064605 Y2 JPH064605 Y2 JP H064605Y2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- flexible lead
- hybrid integrated
- insulating metal
- metal substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 42
- 229910052751 metal Inorganic materials 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 29
- 239000004020 conductor Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000005219 brazing Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988107163U JPH064605Y2 (ja) | 1988-08-12 | 1988-08-12 | 混成集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988107163U JPH064605Y2 (ja) | 1988-08-12 | 1988-08-12 | 混成集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0229563U JPH0229563U (en]) | 1990-02-26 |
| JPH064605Y2 true JPH064605Y2 (ja) | 1994-02-02 |
Family
ID=31341330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988107163U Expired - Lifetime JPH064605Y2 (ja) | 1988-08-12 | 1988-08-12 | 混成集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH064605Y2 (en]) |
-
1988
- 1988-08-12 JP JP1988107163U patent/JPH064605Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0229563U (en]) | 1990-02-26 |
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